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Back to Solder Jet Technology Update
Solder Jet Technology Update
Author/Editor:
D J Wallace, Donald Hayes
Description
Back to Solder Jet Technology Update
Solder Jet Technology (e.g. piezoelectric demand-mode ink-jet printing technology used to dispense molten solder droplets) has demonstrated the ability to place 25-125 micrometer diameter bumps onto metallized wafers, circuit boards, and other substrates. Recent developments are discussed, including test vehicle printing, drop size modulation, microbump printing, and print-on-the-fly. Authors: David B. Wallace, Donald J. Hayes, MicroFab Technologies, Inc., Plano, TX.
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