Material Removal Mechanisms in Lapping and Polishing

Published in the Annals of the CIRP, Vol. 52/2/2003. Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms, however, are poorly understood. Technological outputs (e.g., surface finish, sub-surface damage, part shape) and throughput of lapping and polishing processes are affected by a large number of variables. Individual processes are well controlled within individual enterprises, yet there appears to be little ability to predict process performance a priori. As a first step toward improving process modeling, this paper reviews the fundamental mechanisms of material removal in lapping and polishing processes and identifies key areas where further work is required. Authors: C.J. Evans (Zygo Corporation, Middlefield, CT, USA), E. Paul (Stockton College, Pomona, NJ, USA), D. Dornfeld (University of California, Berkeley, CA, USA), D.A. Lucca (Oklahoma State University, Stillwater, OK, USA), G. Byrne (University College, Dublin, Eire), M. Tricard (QED Technologies, Inc., Rochester, NY, USA), F. Klocke (Fraunhofer Institute, Aachen, Germany), O. Dambon (Fraunhofer Institute, Aachen, Germany), B.A. Mullany (Carl Zeiss, Oberkochen, Germany).