Influence of Heat Treatment on the Mechanical Characteristics...

The influence of high-temperature annealing on the mechanical characteristics of n- and p-type silicon wafers with diameters 76 and 100 mm is investigated. It is shown that after high-temperature annealing, the plastic deformation and related dislocations arise irrespective of the type of conductivity and wafer diameter. The temperature dependences of microhardness, fracture toughness and the length of imprint diagonal are established. The activation energy of dislocation movement is determined from the temperature dependence of microhardness. Moreover, it is revealed that dislocations and sliding strips run from the imprint at room temperature. The obtained results are well explained by the thermal activation of dislocation movement and an elastic stress relaxation. Authors: SH.M. Hasanli, A. M. Hashimov, K. J. Gulmamedov (Technical University of Azerbaijan)