Back to Ceramic Grinding With Self-Sharpening Diamond Wheels Subjected To Whee
Ceramic Grinding With Self-Sharpening Diamond Wheels Subjected To Whee

Ceramic Grinding With Self-Sharpening Diamond Wheels Subjected To Whee

Author/Editor:
Robert S Hahn, PhD, PE, CMfgE, FSME
Printed Pages:
-
Published:
1/10/1993
Product ID:
TP93PUB177

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Description

Back to Ceramic Grinding With Self-Sharpening Diamond Wheels Subjected To Whee
The sharpness of resin-bonded diamond wheels was observed to increase 20-fold when the wheels were subjected to normal-force intensities of 30 to 50 N/MM. Once briefly subjected to those levels, the wheel would cut 15 to 20 times faster than the as-dressed wheel at moderate (lower) force levels. The resin bond wears very rapidly at the high force intensities, causing wheel-regenerative chatter to occur. Accordingly, the chatter-free grind time (CFGT) is short at the high force level.

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