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Back to Grinding Innovation in a Growing Defense Market
Grinding Innovation in a Growing Defense Market
Author/Editor:
John R Besse, K Phillip Varghese PHD, Michael P Hitchiner PhD
Description
Back to Grinding Innovation in a Growing Defense Market
The defense industry is going through an aggressive period of driving cost out of the traditional processing of high-temperature alloys such as Inconel and titanium while developing the ability to finish the new materials such as Ti-Al, HVOF, carbon fiber, and ceramic matrix composites. Capital equipment investment is seeking greater returns together with lower operating (green) costs, while also demanding increased versatility for multisurface processing. Entire processing routes such as ECM, EDM, broaching, milling, and grinding are being closely scrutinized for more efficient alternatives. The reaction of the grinding industry has been rapid to develop a range of engineered conventional abrasive grains with controlled strength and microfracture characteristics for extreme stock removal conditions, new superabrasive bond systems, especially utilizing diamond abrasive, for handling the more novel engine materials, and a deeper understanding of the capabilities and application of current bonded and plated CBN technology. The grinding industry is both enhancing its existing grinding processes and focusing on replacement of other less competitive machining and finishing techniques.
Presented at: Mfg4: Manufacturing 4 the Future, Society of Manufacturing Engineers, May 8-10, 2012, Hartford, Connecticut.
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