Back to Energy Dissipation in Grind Interface--Heat Distribution in the Chip and Workpiece
Energy Dissipation in Grind Interface--Heat Distribution in the Chip and Workpiece

Energy Dissipation in Grind Interface--Heat Distribution in the Chip and Workpiece

Author/Editor:
Ernest J Duwell, Gerald R Abrahamson, R J Cosmano
Printed Pages:
-
Published:
1/10/1984
Product ID:
TP84PUB318

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Description

Back to Energy Dissipation in Grind Interface--Heat Distribution in the Chip and Workpiece

To better understand the mechanisms involved in the grinding of metals with coated abrasives, work similar to that involving grinding wheels has been carried out. Both grinding forces and temperatures have been measured for constant rate tests involving a coated abrasive belt and a series of metals. The effect of adding a grinding aid to the abrasive construction has been looked at for several of the metals.

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