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Yield Improvements In Semiconductor Manufacturing

Yield Improvements In Semiconductor Manufacturing

Author/Editor:
Ms Melissa Smith, Ramesh Rajagopalan
Printed Pages:
-
Published:
1/10/1989
Product ID:
TP89PUB640

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Description

Back to Yield Improvements In Semiconductor Manufacturing
A dispatching scheme that implements composite scheduling policies is developed to maintain a high average outgoing quality level (AOQL) at every stage of the wafer fabrication process. The dispatching scheme selects the jobs to be processed next by periodically alternating between a selected scheduling rule such as first in first out (FIFO) or a job due-date based priority rule (slack) and last in first out (LIFO) priority rule. This dispatching scheme captures many of the quality benefits of JIT while permitting adequate work-in process to smooth out work flow. The dispatching scheme also enables defect detection as quickly as possible and corrective action to be taken at the preceding process.

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